发明申请
US20130330563A1 MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE PLATE AND PRINTED WIRING BOARD USING SAME
审中-公开
改性硅酮化合物和热固性树脂组合物,PREPREG,层压板和印刷线路板
- 专利标题: MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE PLATE AND PRINTED WIRING BOARD USING SAME
- 专利标题(中): 改性硅酮化合物和热固性树脂组合物,PREPREG,层压板和印刷线路板
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申请号: US13980385申请日: 2012-01-17
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公开(公告)号: US20130330563A1公开(公告)日: 2013-12-12
- 发明人: Tomohiko Kotake , Masato Miyatake , Shunsuke Nagai , Shintaro Hashimoto , Yasuo Inoue , Shin Takanezawa , Hikari Murai
- 申请人: Tomohiko Kotake , Masato Miyatake , Shunsuke Nagai , Shintaro Hashimoto , Yasuo Inoue , Shin Takanezawa , Hikari Murai
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Chemical Company, Ltd.
- 当前专利权人: Hitachi Chemical Company, Ltd.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2011-008307 20110118
- 国际申请: PCT/JP2012/050877 WO 20120117
- 主分类号: C08K5/544
- IPC分类号: C08K5/544 ; C09D163/00
摘要:
There are provided a modified silicone compound prepared by reacting: (A) a siloxane diamine represented by the general formula (1); (B) a maleimide compound with at least two N-substituted maleimide groups in the molecular structure; and (C) an amine compound with an acidic substituent; and also provided a thermosetting resin composition, a prepreg, a laminated plate, and a printed wiring board that are formed by using this compound. The multi-layered printed wiring board produced by using the laminated plate formed by using the prepreg obtained from the modified silicone compound and the thermosetting resin composition of the present invention through laminate molding has an excellent glass transition temperature, coefficient of thermal expansion, copper foil adhesion, hygroscopicity, hygroscopic solder heat resistance, and copper-stuck solder heat resistance. Therefore, the multi-layered printed wiring board is useful as a highly integrated semiconductor package and a printed wiring board for an electronic device.