发明申请
- 专利标题： RESIN COMPOSITION FOR SEALING ELECTRICAL ELECTRONIC COMPONENTS, METHOD OF PRODUCING ELECTRICAL ELECTRONIC COMPONENT, AND SEALED ELECTRICAL ELECTRONIC COMPONENT
- 专利标题（中）： 用于密封电子元件的树脂组合物，电子电子元件的制造方法和密封电子元件
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申请号： US14000943申请日： 2012-02-21
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公开(公告)号： US20130331521A1公开(公告)日： 2013-12-12
- 发明人: Daiki Funaoka , Kenji Shiga
- 申请人： Daiki Funaoka , Kenji Shiga
- 优先权： JP2011-036955 20110223; JP2011-078162 20110331
- 国际申请： PCT/JP2012/054031 WO 20120221
- 主分类号： C08L67/03
- IPC分类号： C08L67/03 ; C08L23/08 ; C08L23/06 ; C08L65/04 ; C08L71/08
摘要：
It is provided that a resin composition for sealing electrical electronic components which is not susceptible to gelation even when stagnant under high temperature conditions, and which are excellent in initial bond strength to an aluminum material, and which exhibits superior durability under a cooling and heating cycle load and the like. It is also provided that a sealed electrical electronic component with the resin composition for sealing electrical electronic components. A resin composition for sealing electrical electronic components, containing a crystalline polyester-based elastomer (A), a phenol-modified xylene resin (B1) and/or a phenol resin (B2), and a polyolefin resin (C), and having a melt viscosity of 5 dPa·s or more and 3000 dPa·s or less when dried to a water content of 0.1% or less, heated to 220° C., subjected to a pressure of 1 MPa, and extruded through a die with a hole diameter of 1.0 mm and a thickness of 10 mm.