发明申请
US20130334630A1 MEMORY CELLS, SEMICONDUCTOR DEVICE STRUCTURES, MEMORY SYSTEMS, AND METHODS OF FABRICATION
有权
存储器单元,半导体器件结构,存储器系统和制造方法
- 专利标题: MEMORY CELLS, SEMICONDUCTOR DEVICE STRUCTURES, MEMORY SYSTEMS, AND METHODS OF FABRICATION
- 专利标题(中): 存储器单元,半导体器件结构,存储器系统和制造方法
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申请号: US13527173申请日: 2012-06-19
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公开(公告)号: US20130334630A1公开(公告)日: 2013-12-19
- 发明人: Witold Kula , Gurtej S. Sandhu , Stephen J. Kramer
- 申请人: Witold Kula , Gurtej S. Sandhu , Stephen J. Kramer
- 申请人地址: US ID Boise
- 专利权人: MICRON TECHNOLOGY, INC.
- 当前专利权人: MICRON TECHNOLOGY, INC.
- 当前专利权人地址: US ID Boise
- 主分类号: H01L29/82
- IPC分类号: H01L29/82 ; H01L21/8246
摘要:
Methods of forming magnetic memory cells are disclosed. Magnetic and non-magnetic materials are formed into a primal precursor structure in an initial stress state of essentially no strain, compressive strain, or tensile strain. A stress-compensating material, e.g., a non-sacrificial, conductive material, is formed to be disposed on the primal precursor structure to form a stress-compensated precursor structure in a net beneficial stress state. Thereafter, the stress-compensated precursor structure may be patterned to form a cell core of a memory cell. The net beneficial stress state of the stress-compensated precursor structure lends to formation of one or more magnetic regions, in the cell core, exhibiting a vertical magnetic orientation without deteriorating a magnetic strength of the one or more magnetic regions. Also disclosed are memory cells, memory cell structures, semiconductor device structures, and spin torque transfer magnetic random access memory (STT-MRAM) systems.
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