Invention Application
- Patent Title: METHOD FOR MANUFACTURING A CHIP RESISTOR
- Patent Title (中): 制造芯片电阻的方法
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Application No.: US13783931Application Date: 2013-03-04
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Publication No.: US20130341301A1Publication Date: 2013-12-26
- Inventor: Full Chen
- Applicant: RALEC ELECTRONIC CORPORATION
- Applicant Address: TW Kaohsiung
- Assignee: RALEC ELECTRONIC CORPORATION
- Current Assignee: RALEC ELECTRONIC CORPORATION
- Current Assignee Address: TW Kaohsiung
- Priority: TW101122620 20120625
- Main IPC: H01C17/00
- IPC: H01C17/00 ; H01C7/00

Abstract:
In a method of manufacturing a chip resistor, a semi-product is formed by sandwiching an electric-insulating material layer between an electric-conducting material layer and a heat-dissipating material layer. Resistor sections arranged in an array on the semi-product are formed by forming longitudinal first slots and transverse second slots through the semi-product. Slits are formed on a first layer of each resistor section to form a resistor main body. A dividing slot is formed on a second layer of each resistor section. Two electrodes are formed to be electrically connected to opposite ends of the resistor main body. The resistor sections are trimmed from the semi-product to obtain the chip resistors.
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