Invention Application
US20140001409A1 POLYAMIDE-IMIDE RESIN FILM AND SEAMLESS BELT INCLUDING THE RESIN FILM
审中-公开
聚酰亚胺树脂薄膜和无缝皮带，包括树脂薄膜
- Patent Title: POLYAMIDE-IMIDE RESIN FILM AND SEAMLESS BELT INCLUDING THE RESIN FILM
- Patent Title (中): 聚酰亚胺树脂薄膜和无缝皮带，包括树脂薄膜
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Application No.: US13927897Application Date: 2013-06-26
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Publication No.: US20140001409A1Publication Date: 2014-01-02
- Inventor: Hisae KITAGAWA , Shunsuke MASAKI
- Applicant: NITTO DENKO CORPORATION
- Priority: JP2012-144174 20120627; JP2013-096802 20130502
- Main IPC: H01B1/20
- IPC: H01B1/20
Abstract:
A polyamide-imide resin composition according to embodiment of the present invention, including a polyamide-imide resin obtained by causing acid components (A) containing a dimer acid and a polyisocyanate component (B) to react with each other, wherein a ratio of the dimer acid in the acid components (A) is 3 mol % to 55 mol %.
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