发明申请
US20140002927A1 WRITE HEAD STRUCTURE DESIGNED FOR TEMPERATURE INSENSITIVE WRITING PERFORMANCE
审中-公开
写入头结构设计用于温度敏感写作性能
- 专利标题： WRITE HEAD STRUCTURE DESIGNED FOR TEMPERATURE INSENSITIVE WRITING PERFORMANCE
- 专利标题（中）： 写入头结构设计用于温度敏感写作性能
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申请号： US13536880申请日： 2012-06-28
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公开(公告)号： US20140002927A1公开(公告)日： 2014-01-02
- 发明人: Wen-Chien D. Hsiao , Terence T.L. Lam , Yansheng Luo , Xinjiang Shen
- 申请人： Wen-Chien D. Hsiao , Terence T.L. Lam , Yansheng Luo , Xinjiang Shen
- 申请人地址： NL Amsterdam
- 专利权人： Hitachi Global Storage Technologies Netherlands B.V.
- 当前专利权人： Hitachi Global Storage Technologies Netherlands B.V.
- 当前专利权人地址： NL Amsterdam
- 主分类号： G11B5/187
- IPC分类号： G11B5/187
摘要：
A magnetic write head for magnetic data recording that includes a structure having a low coefficient of thermal expansion for controlling thermal expansion of the write head. The structure having a low coefficient of thermal expansion has a shape that substantially conforms to the shape of the write coil, such that both the write coil and the structure having a low coefficient of thermal expansion have a central portion that is located closest to the air bearing surface and outer end portions that bend away from the air bearing surface to form a horseshoe shape.
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