发明申请
- 专利标题： SUBSTRATE PROCESSING APPARATUS, SUBSTRATE SUPPORTER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- 专利标题（中）： 基板加工装置，基板支撑件及制造半导体装置的方法
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申请号： US13980144申请日： 2012-01-16
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公开(公告)号： US20140004710A1公开(公告)日： 2014-01-02
- 发明人: Masakazu Sakata , Hidehiro Yanai
- 申请人： Masakazu Sakata , Hidehiro Yanai
- 申请人地址： JP Tokyo
- 专利权人： HITACHI KOKUSAI ELECTRIC INC.
- 当前专利权人： HITACHI KOKUSAI ELECTRIC INC.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2011-007884 20110118
- 国际申请： PCT/JP2012/050729 WO 20120116
- 主分类号： H01L21/02
- IPC分类号： H01L21/02
摘要：
A substrate processing apparatus of the present invention includes a substrate placement stage installed in the process chamber, and configured to place the substrate on a substrate placement surface, with a flange provided on its side face; a heating element arranged in the substrate placement stage and configured to heat the substrate; a plurality of struts configured to support the flange from below, and an exhaust unit configured to exhaust an atmosphere in the process chamber, wherein the supporting member is provided between the substrate placement stage and the plurality of struts.
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