发明申请
- 专利标题: DRAIN EXTENDED MOS DEVICE FOR BULK FINFET TECHNOLOGY
- 专利标题(中): 用于大容量FINFET技术的漏极扩展MOS器件
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申请号: US13540762申请日: 2012-07-03
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公开(公告)号: US20140008733A1公开(公告)日: 2014-01-09
- 发明人: Mayank Shrivastava , Harald Gossner
- 申请人: Mayank Shrivastava , Harald Gossner
- 申请人地址: DE Neubiberg
- 专利权人: Intel Mobile Communications GmbH
- 当前专利权人: Intel Mobile Communications GmbH
- 当前专利权人地址: DE Neubiberg
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L21/336
摘要:
Some aspects relate to a FinFET that includes a semiconductor fin disposed over a semiconductor substrate and extending laterally between a source region and a drain region. A shallow trench isolation (STI) region laterally surrounds a lower portion of the semiconductor fin, and an upper portion of the semiconductor fin remains above the STI region. A gate electrode traverses over the semiconductor fin to define a channel region in the semiconductor fin under the conductive gate electrode. A punch-through blocking region can extend between the source region and the channel region in the lower portion of the semiconductor fin. A drain extension region can extend between the drain region and the channel region in the lower portion of the semiconductor fin. Other devices and methods are also disclosed.
公开/授权文献
- US08629420B1 Drain extended MOS device for bulk FinFET technology 公开/授权日:2014-01-14
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