Invention Application
US20140008788A1 NON-CIRCULAR UNDER BUMP METALLIZATION (UBM) STRUCTURE, ORIENTATION OF NON-CIRCULAR UBM STRUCTURE AND TRACE ORIENTATION TO INHIBIT PEELING AND/OR CRACKING
有权
非圆形非金属结构（UBM）结构，非圆形UBM结构的定向和跟踪方向，以阻止剥离和/或破裂
- Patent Title: NON-CIRCULAR UNDER BUMP METALLIZATION (UBM) STRUCTURE, ORIENTATION OF NON-CIRCULAR UBM STRUCTURE AND TRACE ORIENTATION TO INHIBIT PEELING AND/OR CRACKING
- Patent Title (中): 非圆形非金属结构（UBM）结构，非圆形UBM结构的定向和跟踪方向，以阻止剥离和/或破裂
-
Application No.: US13777271Application Date: 2013-02-26
-
Publication No.: US20140008788A1Publication Date: 2014-01-09
- Inventor: Zhongping Bao , Lily Zhao , Michael Han
- Applicant: QUALCOMM INCORPORATED
- Applicant Address: US CA San Diego
- Assignee: Qualcomm Incorporated
- Current Assignee: Qualcomm Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
Some exemplary embodiments of this disclosure pertain to a semiconductor package that includes a packaging substrate, a die and a set of under bump metallization (UBM) structures coupled to the packaging substrate and the die. Each UBM structure has a non-circular cross-section along its respective lateral dimension. Each UBM structure includes a first narrower portion and a second wider portion. The first narrower portion has a first width. The second wider portion has a second width that is greater than the first width. Each UBM structure is oriented towards a particular region of the die such that the first narrower portion of the UBM structure is closer than the second wider portion of the UBM structure to the particular region of the die.
Public/Granted literature
Information query
IPC分类:
