发明申请
- 专利标题: METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- 专利标题(中): 制造半导体器件的方法
-
申请号: US13910607申请日: 2013-06-05
-
公开(公告)号: US20140011349A1公开(公告)日: 2014-01-09
- 发明人: Hiroyuki OKAZAKI , Takuma Nanjo , Yosuke Suzuki , Akifumi Imai , Muneyoshi Suita , Eiji Yagyu
- 申请人: Mitsubishi Electric Corporation
- 优先权: JP2012-151680 20120705; JP2013-077408 20130403
- 主分类号: H01L29/66
- IPC分类号: H01L29/66
摘要:
The present invention relates to a method for manufacturing a heterojunction semiconductor device including an AlGaN layer, the method including the steps of (a) forming a dummy electrode in a region where a gate electrode is arranged on the AlGaN layer, (b) depositing a dielectric film on the AlGaN layer by exposing side surfaces of the dummy electrode, using a device having anisotropy, (c) forming an opening in the dielectric film by removing the dummy electrode, and (d) forming the gate electrode that extends from inside the opening onto the dielectric film in a vicinity of the opening.
公开/授权文献
- US08987125B2 Method for manufacturing semiconductor device 公开/授权日:2015-03-24
信息查询
IPC分类: