发明申请
- 专利标题： NOVEL POLYAMIC ACID, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM AND CIRCUIT BOARD
- 专利标题（中）： 新型聚氨酯，感光树脂组合物，干膜和电路板
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申请号： US14006062申请日： 2012-03-19
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公开(公告)号： US20140011905A1公开(公告)日： 2014-01-09
- 发明人: You-Jin Kyung , Hee-Jung Kim , Kwang-Joo Lee , Jung-Hak Kim
- 申请人： You-Jin Kyung , Hee-Jung Kim , Kwang-Joo Lee , Jung-Hak Kim
- 申请人地址： KR Seoul
- 专利权人： LG CHEM, LTD.
- 当前专利权人： LG CHEM, LTD.
- 当前专利权人地址： KR Seoul
- 优先权： KR10-2011-0024523 20110318; KR10-2011-0038030 20110422
- 国际申请： PCT/KR2012/001963 WO 20120319
- 主分类号： H05K3/00
- IPC分类号： H05K3/00
摘要：
The present invention relates to novel polyamic acid; a photosensitive resin composition satisfying excellent flexibility and low stiffness and exhibiting excellent heat resistance and plating resistance; a dry film obtained from the photosensitive resin composition; and a circuit board including the dry film.
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