Invention Application
- Patent Title: LIGHT-EMITTING-ELEMENT MOUNT SUBSTRATE AND LED DEVICE
- Patent Title (中): 发光元件安装基板和LED器件
-
Application No.: US14029635Application Date: 2013-09-17
-
Publication No.: US20140014986A1Publication Date: 2014-01-16
- Inventor: Kazuhiro YOSHIDA , Teiji YAMAMOTO , Akira KUMADA
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Priority: JP2011-065970 20110324
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L27/15

Abstract:
A light-emitting-element mount substrate formed by relatively simple manufacturing steps, having a good heat release property, and having a high mechanical strength; and an LED device including the light-emitting-element mount substrate are provided. A substrate body of a light-emitting-element mount substrate is made of a low-resistance semiconductor (e.g., n-type silicon) substrate, and is divided into a first and second individual substrate bodies by an insulating layer. A first front-surface mounting electrode and a first external-connection electrode are formed on respective first and second major surfaces (e.g., front and back surfaces) of the first individual substrate body. A second front-surface mounting electrode and a second external-connection electrode are formed respective first and second major surfaces (e.g., front and back surfaces) of the second individual substrate body. The insulating layer has a shape different from a straight-line shape in plan view.
Public/Granted literature
- US09240535B2 Light-emitting-element mount substrate and LED device Public/Granted day:2016-01-19
Information query
IPC分类: