发明申请
US20140016779A1 TAMPER RESISTANT ELECTRONIC PACKAGES WITH QUANTUM INTERCONNECTS
审中-公开
具有量子互连的防篡改电子封装
- 专利标题: TAMPER RESISTANT ELECTRONIC PACKAGES WITH QUANTUM INTERCONNECTS
- 专利标题(中): 具有量子互连的防篡改电子封装
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申请号: US13547412申请日: 2012-07-12
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公开(公告)号: US20140016779A1公开(公告)日: 2014-01-16
- 发明人: Christopher B. Lirakis
- 申请人: Christopher B. Lirakis
- 申请人地址: US MA Cambridge
- 专利权人: RAYTHEON BBN TECHNOLOGIES CORP.
- 当前专利权人: RAYTHEON BBN TECHNOLOGIES CORP.
- 当前专利权人地址: US MA Cambridge
- 主分类号: H04L9/00
- IPC分类号: H04L9/00 ; H04L9/08
摘要:
A method for resisting tampering, the method including discovering a plurality of electronic packages for communication, each of the plurality of electronic packages having an associated quantum state table, mapping a plurality of communications paths among the plurality of electronic packages, for each communication path of the plurality of communications paths, making an entry into the quantum state table, negotiating key material for each of the plurality of communications paths, for a plurality of data exchanges along each of the plurality of communications paths generating a key, and encrypting a data exchange on a communications path with the key.
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