发明申请
- 专利标题： SEMICONDUCTOR PACKAGE WITH SINGLE SIDED SUBSTRATE DESIGN AND MANUFACTURING METHODS THEREOF
- 专利标题（中）： 具有单面基板的半导体封装及其制造方法
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申请号： US14033673申请日： 2013-09-23
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公开(公告)号： US20140021636A1公开(公告)日： 2014-01-23
- 发明人: Yuan-Chang Su , Shih-Fu Huang , Chia-Cheng Chen , Tzu-Hui Chen , Kuang-Hsiung Chen , Pao-Ming Hsieh , Ming Chiang Lee , Bernd Karl Appelt
- 申请人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 申请人地址： TW Kaosiung
- 专利权人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 当前专利权人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 当前专利权人地址： TW Kaosiung
- 优先权： TW99112317 20100420
- 主分类号： H01L23/522
- IPC分类号： H01L23/522
摘要：
A multilayer substrate includes a first outer conductive patterned layer, a first insulating layer exposing a portion of the first outer conductive patterned layer to define a first set of pads, a second outer conductive patterned layer, and a second insulating layer exposing a portion of the second outer conductive patterned layer to define a second set of pads. The multilayer substrate further includes inner layers each with an inner conductive patterned layer, multiple inner conductive posts formed adjacent to the inner conductive patterned layer, and an inner dielectric layer, where the inner conductive patterned layer and the inner conductive posts are embedded in the inner dielectric layer, and a top surface of each of the inner conductive posts is exposed from the inner dielectric layer.
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