Invention Application
- Patent Title: MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME
- Patent Title (中): 多层陶瓷电子元件及其制造方法
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Application No.: US13685194Application Date: 2012-11-26
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Publication No.: US20140022690A1Publication Date: 2014-01-23
- Inventor: Sung Woo KIM , Jae Yeol CHOI , Yu Na KIM , Jong Ho LEE
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2012-0078848 20120719
- Main IPC: H01G4/30
- IPC: H01G4/30

Abstract:
There is provided a multilayered ceramic electronic component including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on at least one of the dielectric layers and alternately exposed through both ends of the ceramic body in a stacking direction of the ceramic body; an a step compensation cover including a ceramic material having a viscosity higher than that of a ceramic material included in the ceramic body and formed on at least one of an upper surface and a lower surface of the ceramic body.
Public/Granted literature
- US09001493B2 Multilayered ceramic electronic component and manufacturing method of the same Public/Granted day:2015-04-07
Information query