Invention Application
- Patent Title: LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME
- Patent Title (中): 层压陶瓷电子元件及其制造方法
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Application No.: US13678364Application Date: 2012-11-15
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Publication No.: US20140022698A1Publication Date: 2014-01-23
- Inventor: Han Soung JEONG , Chang Hoon KIM , Sang Hoon KWON , Seok Hyun YOON
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2012-0079527 20120720
- Main IPC: H01G4/12
- IPC: H01G4/12 ; H01G4/30

Abstract:
There is provided a laminated ceramic electronic component, including a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein when a value of 1% is set to be D1, a value of 50% is set to be D50, and a value of 99% is set to be D99 in a cumulative distribution of dielectric grains by an average particle diameter thereof within the dielectric layer, 2≦D99/D50≦3 and 2≦D50/D1≦3 are satisfied. A high-capacity laminated ceramic electronic component may be implemented with improved adhesion between the dielectric layer and the internal electrode, and improved withstand voltage characteristics and excellent reliability may be implemented.
Public/Granted literature
- US09202625B2 Laminated ceramic electronic component and method of fabricating the same Public/Granted day:2015-12-01
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