发明申请
US20140024174A1 USING AN OPTICALLY TRANSPARENT SOLID MATERIAL AS A SUPPORT STRUCTURE FOR ATTACHMENT OF A SEMICONDUCTOR MATERIAL TO A SUBSTRATE
审中-公开
使用光学透明固体材料作为将基板材料连接到半导体材料的支撑结构
- 专利标题： USING AN OPTICALLY TRANSPARENT SOLID MATERIAL AS A SUPPORT STRUCTURE FOR ATTACHMENT OF A SEMICONDUCTOR MATERIAL TO A SUBSTRATE
- 专利标题（中）： 使用光学透明固体材料作为将基板材料连接到半导体材料的支撑结构
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申请号： US13997649申请日： 2011-12-19
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公开(公告)号： US20140024174A1公开(公告)日： 2014-01-23
- 发明人: Robert L. Sankman , Edward A. Zarbock
- 申请人： Robert L. Sankman , Edward A. Zarbock
- 国际申请： PCT/US11/65920 WO 20111219
- 主分类号： H01L25/03
- IPC分类号： H01L25/03
摘要：
Electronic devices and methods for fabricating electronic devices are described. One method includes attaching an optically transparent solid material to a body of semiconducting material in which microelectronic devices are formed. The method also includes attaching a first surface of a body portion, comprising a portion of the body, to a substrate while a portion of the optically transparent solid material is attached to a second surface of the body portion. The method also includes removing the optically transparent solid material from the second surface of the body portion after the attaching the first surface of the body portion to the substrate.
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