- 专利标题： USE OF GRAPHENE TO LIMIT COPPER SURFACE OXIDATION, DIFFUSION AND ELECTROMIGRATION IN INTERCONNECT STRUCTURES
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申请号： US13551962申请日： 2012-07-18
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公开(公告)号： US20140024211A1公开(公告)日： 2014-01-23
- 发明人: John A. Ott , Ageeth A. Bol
- 申请人： John A. Ott , Ageeth A. Bol
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L21/768
- IPC分类号： H01L21/768
摘要：
A contiguous layer of graphene is formed on exposed sidewall surfaces and a topmost surface of a copper-containing structure that is present on a surface of a substrate. The presence of the contiguous layer of graphene on the copper-containing structure reduces copper oxidation and surface diffusion of copper ions and thus improves the electromigration resistance of the structure. These benefits can be obtained using graphene without increasing the resistance of copper-containing structure.