发明申请
- 专利标题: HOT RUNNER MANIFOLDS INTERCONNECTED IN A COMMON PLANE
- 专利标题(中): 在普通平面中互连的热流道模块
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申请号: US13560320申请日: 2012-07-27
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公开(公告)号: US20140027084A1公开(公告)日: 2014-01-30
- 发明人: Denis Babin
- 申请人: Denis Babin
- 申请人地址: CA Georgetown
- 专利权人: MOLD-MASTERS (2007) LIMITED
- 当前专利权人: MOLD-MASTERS (2007) LIMITED
- 当前专利权人地址: CA Georgetown
- 主分类号: B29C45/03
- IPC分类号: B29C45/03 ; B22D17/20
摘要:
A hot runner apparatus includes a mold plate defining a pocket; a plurality of sub-manifolds; and a bridge manifold positioned in the pocket and between the sub-manifolds. The bridge manifold and the sub-manifolds are oriented in a common plane. The bridge manifold receives a melt from a melt source. Each of the sub-manifolds is coupled to the bridge manifold to receive the melt from the bridge manifold via a junction between an opening of a network of melt channels within the bridge manifold and an opening of a network of melt channels within each of the sub-manifolds. The sub-manifolds are urged against the bridge manifold to form a seal therebetween, when the bridge manifold and the sub-manifolds thermally expand urging the sub-manifolds against contact regions of a pair of opposing walls of the pocket. The respective opposing walls define a hollow region separated from the respective contact regions by a wall portion.
公开/授权文献
- US08690563B2 Hot runner manifolds interconnected in a common plane 公开/授权日:2014-04-08
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