发明申请
- 专利标题： SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT
- 专利标题（中）： 半导体元件和半导体元件的制造方法
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申请号： US13560626申请日： 2012-07-27
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公开(公告)号： US20140027879A1公开(公告)日： 2014-01-30
- 发明人: Joachim Weyers , Kevni Bueyuektas , Franz Hirler , Anton Mauder
- 申请人： Joachim Weyers , Kevni Bueyuektas , Franz Hirler , Anton Mauder
- 申请人地址： AT Villach
- 专利权人： Infineon Technologies Austria AG
- 当前专利权人： Infineon Technologies Austria AG
- 当前专利权人地址： AT Villach
- 主分类号： H01L49/02
- IPC分类号： H01L49/02
摘要：
One aspect of the invention relates to a semiconductor component with a semiconductor body with a top side and with a bottom side. A first coil that is monolithically integrated with the semiconductor body is arranged distant from the bottom side and comprises N first windings, wherein N≧1. The first coil has a first coil axis that extends in a direction different from a surface normal of the bottom side.
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