发明申请
US20140027889A1 RECONSTITUTED WAFER PACKAGE WITH HIGH VOLTAGE DISCRETE ACTIVE DICE AND INTEGRATED FIELD PLATE FOR HIGH TEMPERATURE LEAKAGE CURRENT STABILITY
有权
具有高电压离散主动切屑和集成现场板的高温泄漏电流稳定性的重新配置的包装
- 专利标题： RECONSTITUTED WAFER PACKAGE WITH HIGH VOLTAGE DISCRETE ACTIVE DICE AND INTEGRATED FIELD PLATE FOR HIGH TEMPERATURE LEAKAGE CURRENT STABILITY
- 专利标题（中）： 具有高电压离散主动切屑和集成现场板的高温泄漏电流稳定性的重新配置的包装
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申请号： US13556385申请日： 2012-07-24
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公开(公告)号： US20140027889A1公开(公告)日： 2014-01-30
- 发明人: Mark R. Boone , Mohsen Askarinya , Larry E. Tyler
- 申请人： Mark R. Boone , Mohsen Askarinya , Larry E. Tyler
- 专利权人： Medtronic, Inc.
- 当前专利权人： Medtronic, Inc.
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A reconstituted wafer level package for a versatile high-voltage capable component is disclosed. The reconstituted wafer package includes a dice substantially encapsulated by a mold material except for a first face. A dielectric layer is disposed on the first face of the dice. The package further includes an array of ball bumps formed on an exterior facing portion of the dielectric layer. Further, a field plate is disposed within the dielectric material and interposed between the first face of the dice and the ball bump array. The field plate may be spaced from the dice by a predetermined distance to prevent dielectric breakdown of the material of the dielectric layer.
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