Invention Application
- Patent Title: INTEGRATED SENSORS
- Patent Title (中): 集成传感器
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Application No.: US13452218Application Date: 2012-04-20
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Publication No.: US20140028995A1Publication Date: 2014-01-30
- Inventor: Alexandre M. Bratkovski , R. Stanley Williams , Zhiyong Li
- Applicant: Alexandre M. Bratkovski , R. Stanley Williams , Zhiyong Li
- Main IPC: G01N21/01
- IPC: G01N21/01

Abstract:
Examples of integrated sensors are disclosed herein. An example of an integrated sensor includes a flexible substrate, and an array of spaced apart sensing members formed on a surface of the flexible substrate. Each of the spaced apart sensing members includes a plurality of polygon assemblies. The polygon assemblies are arranged in a controlled pattern on the surface of the flexible substrate such that each of the plurality of polygon assemblies is a predetermined distance from each other of the plurality of polygon assemblies, and each of the plurality of polygon assemblies including collapsible signal amplifying structures controllably positioned in a predetermined geometric shape.
Public/Granted literature
- US09453793B2 Integrated sensors Public/Granted day:2016-09-27
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