发明申请
- 专利标题： Substrate with Multiple Encapsulated Devices
- 专利标题（中）： 具有多个封装器件的基板
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申请号： US13563626申请日： 2012-07-31
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公开(公告)号： US20140035071A1公开(公告)日： 2014-02-06
- 发明人: Po-Jui Chen , Gary Yama , Matthieu Liger , Andrew Graham
- 申请人： Po-Jui Chen , Gary Yama , Matthieu Liger , Andrew Graham
- 申请人地址： DE Stuttgart
- 专利权人： Robert Bosch GmbH
- 当前专利权人： Robert Bosch GmbH
- 当前专利权人地址： DE Stuttgart
- 主分类号： H01L29/84
- IPC分类号： H01L29/84 ; H01L29/66
摘要：
A device with multiple encapsulated functional layers, includes a substrate, a first functional layer positioned above a top surface of the substrate, the functional layer including a first device portion, a first encapsulating layer encapsulating the first functional layer, a second functional layer positioned above the first encapsulating layer, the second functional layer including a second device portion, and a second encapsulating layer encapsulating the second functional layer.
公开/授权文献
- US09455353B2 Substrate with multiple encapsulated devices 公开/授权日：2016-09-27
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