Invention Application
US20140037945A1 BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE BONDING METHOD, BONDING-SUBSTRATE FABRICATION APPARATUS, AND SUBSTRATE ASSEMBLY
审中-公开
接合基板制造方法，接合基板，基板接合方法，接合基板制造装置和基板装配
- Patent Title: BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE BONDING METHOD, BONDING-SUBSTRATE FABRICATION APPARATUS, AND SUBSTRATE ASSEMBLY
- Patent Title (中): 接合基板制造方法，接合基板，基板接合方法，接合基板制造装置和基板装配
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Application No.: US13982686Application Date: 2012-01-30
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Publication No.: US20140037945A1Publication Date: 2014-02-06
- Inventor: Tadatomo Suga , Akira Yamauchi , Ryuichi Kondou , Yoshiie Matsumoto
- Applicant: Tadatomo Suga , Akira Yamauchi , Ryuichi Kondou , Yoshiie Matsumoto
- Applicant Address: JP Tokyo JP Tokyo JP Tokyo JP Kyoto
- Assignee: Tadatomo Suga,LAN TECHNICAL SERVICE CO., LTD.,TAIYO YUDEN CO., LTD.,BONDTECH CO., LTD.
- Current Assignee: Tadatomo Suga,LAN TECHNICAL SERVICE CO., LTD.,TAIYO YUDEN CO., LTD.,BONDTECH CO., LTD.
- Current Assignee Address: JP Tokyo JP Tokyo JP Tokyo JP Kyoto
- Priority: JP2011-019060 20110131
- International Application: PCT/JP2012/051936 WO 20120130
- Main IPC: B32B38/08
- IPC: B32B38/08 ; B32B7/04
Abstract:
[Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.
Public/Granted literature
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