Invention Application
- Patent Title: WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Patent Title (中): 接线板和制造接线板的方法
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Application No.: US13963246Application Date: 2013-08-09
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Publication No.: US20140042602A1Publication Date: 2014-02-13
- Inventor: Toyotaka SHIMABE , Keisuke SHIMIZU , Toshiki FURUTANI
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Ogaki-shi
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki-shi
- Priority: JP2012-178953 20120810
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L23/00 ; H01L23/495
Abstract:
A wiring board includes a substrate having a cavity, and an electronic component accommodated in the cavity of the substrate. The substrate has a thickness which is greater than a thickness of the electronic component such that a ratio of the thickness of the substrate to the thickness of the electronic component is set in a range of 0.3 or greater and 0.7 or less.
Public/Granted literature
- US08952507B2 Wiring board and method for manufacturing wiring board Public/Granted day:2015-02-10
Information query
