Invention Application
US20140042602A1 WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD 有权
接线板和制造接线板的方法

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
Abstract:
A wiring board includes a substrate having a cavity, and an electronic component accommodated in the cavity of the substrate. The substrate has a thickness which is greater than a thickness of the electronic component such that a ratio of the thickness of the substrate to the thickness of the electronic component is set in a range of 0.3 or greater and 0.7 or less.
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