发明申请
- 专利标题： Interposer System and Method
- 专利标题（中）： 内插系统和方法
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申请号： US13572240申请日： 2012-08-10
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公开(公告)号： US20140042643A1公开(公告)日： 2014-02-13
- 发明人: Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Der-Chyang Yeh
- 申请人： Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Der-Chyang Yeh
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L21/50
摘要：
A system and method for providing an interposer is provided. An embodiment comprises forming a first region and a second region on an interposer wafer with a scribe region between the first region and the second region. The first region and the second region are then connected to each other through circuitry located over the scribe region. In another embodiment, the first region and the second region may be separated from each other and then encapsulated together prior to the first region being connected to the second region.
公开/授权文献
- US08810006B2 Interposer system and method 公开/授权日：2014-08-19