Invention Application
US20140043463A1 TDI Sensor Modules With Localized Driving And Signal Processing Circuitry For High Speed Inspection 有权
TDI传感器模块具有局部驱动和信号处理电路,用于高速检测

  • Patent Title: TDI Sensor Modules With Localized Driving And Signal Processing Circuitry For High Speed Inspection
  • Patent Title (中): TDI传感器模块具有局部驱动和信号处理电路,用于高速检测
  • Application No.: US14058061
    Application Date: 2013-10-18
  • Publication No.: US20140043463A1
    Publication Date: 2014-02-13
  • Inventor: David L. BrownYung-Ho Chuang
  • Applicant: KLA-Tencor Corporation
  • Applicant Address: US CA Milpitas
  • Assignee: KLA-Tencor Corporation
  • Current Assignee: KLA-Tencor Corporation
  • Current Assignee Address: US CA Milpitas
  • Main IPC: H04N7/18
  • IPC: H04N7/18
TDI Sensor Modules With Localized Driving And Signal Processing Circuitry For High Speed Inspection
Abstract:
An inspection system for inspecting a surface of a wafer/mask/reticle can include a modular array. The modular array can include a plurality of time delay integration (TDI) sensor modules, each TDI sensor module having a TDI sensor and a plurality of localized circuits for driving and processing the TDI sensor. At least one of the localized circuits can control a clock associated with the TDI sensor. At least one light pipe can be used to distribute a source illumination to the plurality of TDI sensor modules. The plurality of TDI sensor modules can be positioned capture a same inspection region or different inspection regions. The plurality of TDI sensor modules can be identical or provide for different integration stages. Spacing of the modules can be arranged to provide 100% coverage of the inspection region in one pass or for fractional coverage requiring two or more passes for complete coverage.
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