Invention Application
- Patent Title: MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 多层陶瓷电子元件及其制造方法
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Application No.: US13828607Application Date: 2013-03-14
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Publication No.: US20140043721A1Publication Date: 2014-02-13
- Inventor: Jong Han KIM , Eung Soo KIM , Seung Ho LEE , Jae Yeol CHOI
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2012-0086909 20120808
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/12

Abstract:
There are provided a multilayer ceramic electronic component and a method of manufacturing the same, the multilayer ceramic electronic component, including: a ceramic body including a plurality of dielectric layers laminated therein, each dielectric layer having an average thickness of 0.65 μM or less; internal electrodes disposed to face each other while having each dielectric layer interposed therebetween in the ceramic body; and external electrodes electrically connected to the internal electrodes, wherein, when td denotes the average thickness of each of the dielectric layers and te denotes an average thickness of each of the internal electrodes, te/td≦0.77 is satisfied.
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