Invention Application
- Patent Title: TANTALUM CAPACITOR AND METHOD OF PREPARING THE SAME
- Patent Title (中): 钽电容器及其制备方法
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Application No.: US13784300Application Date: 2013-03-04
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Publication No.: US20140043730A1Publication Date: 2014-02-13
- Inventor: Jae Kwang KIM , Wan Suk YANG , Hyun Sub OH
- Applicant: Jae Kwang KIM , Wan Suk YANG , Hyun Sub OH
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2012-0086907 20120808
- Main IPC: H01G9/042
- IPC: H01G9/042

Abstract:
There is provided a tantalum capacitor including: a capacitor body containing a tantalum powder and having a tantalum wire; a molded portion surrounding the tantalum wire and the capacitor body; an anode lead frame electrically connected to the tantalum wire; an cathode lead frame including a mounting portion having the capacitor body mounted thereon and a step formed on a lower surface thereof, and an cathode terminal portion bent at the mounting portion to be closely adhered to one end surface of the molded portion; and an adhesive layer formed between the one end surface of the molded portion and the cathode terminal portion.
Information query