发明申请
US20140043778A1 ATTACHMENT FOR PREVENTING LIQUID FROM ADHERING TO ELECTRONIC COMPONENT 有权
防止液体与电子部件接触的附件

  • 专利标题: ATTACHMENT FOR PREVENTING LIQUID FROM ADHERING TO ELECTRONIC COMPONENT
  • 专利标题(中): 防止液体与电子部件接触的附件
  • 申请号: US13955133
    申请日: 2013-07-31
  • 公开(公告)号: US20140043778A1
    公开(公告)日: 2014-02-13
  • 发明人: Norihiro CHOUKiichi INABA
  • 申请人: FANUC Corporation
  • 申请人地址: JP Yamanashi
  • 专利权人: FANUC Corporation
  • 当前专利权人: FANUC Corporation
  • 当前专利权人地址: JP Yamanashi
  • 优先权: JP2012-174862 20120807
  • 主分类号: H05K1/18
  • IPC分类号: H05K1/18
ATTACHMENT FOR PREVENTING LIQUID FROM ADHERING TO ELECTRONIC COMPONENT
摘要:
An attachment capable of preventing liquid from adhering to a specific electronic component within an electronic device. An electronic substrate has an attachment which can be attached to and detached from the electronic substrate. The attachment has an attachment part detachably attached to an edge of the electronic substrate; and a shield part connected to or integrally formed with the attachment part. The attachment part is a clip-like member having a certain degree of elasticity, and is configured to grip an edge of the electronic substrate so that the attachment is held at a predetermined place. The shield part has an inclined surface, and is configured to shield the electronic component so that liquid, such as a splash or droplet moving toward the electronic component, does not adhere to the component when the attachment is held at the predetermined place.
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