发明申请
- 专利标题： LEAD-FREE SOLDER COMPOSITION FOR GLASS
- 专利标题（中）： 玻璃无铅焊接组合物
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申请号： US13712326申请日： 2012-12-12
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公开(公告)号： US20140044589A1公开(公告)日： 2014-02-13
- 发明人: Hae Won Jeong , Hyun Dal Park , Tae Seung Lee , Seung Kyu Kim , Hong Nho Joo , Ho June Yoon , Min Ho Bak , Joo Dong Lee , Hyun Chae Jung , Sun Myung Lee
- 申请人： HYUNDAI MOTOR COMPANY , KIA MOTORS CORPORATION , KOREA AUTOGLASS CORPORATION , HEESUNG MATERIAL LTD.
- 申请人地址： KR Seoul KR Yongin, Gyeonggi-Do KR Yeongi, Chungcheongnam-Do KR Seoul
- 专利权人： HYUNDAI MOTOR COMPANY,HEESUNG MATERIAL LTD.,KOREA AUTOGLASS CORPORATION,KIA MOTORS CORPORATION
- 当前专利权人： HYUNDAI MOTOR COMPANY,HEESUNG MATERIAL LTD.,KOREA AUTOGLASS CORPORATION,KIA MOTORS CORPORATION
- 当前专利权人地址： KR Seoul KR Yongin, Gyeonggi-Do KR Yeongi, Chungcheongnam-Do KR Seoul
- 优先权： KR10-2012-0088178 20120813
- 主分类号： B23K35/24
- IPC分类号： B23K35/24
摘要：
The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.
公开/授权文献
- US09333594B2 Lead-free solder composition for glass 公开/授权日：2016-05-10
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