发明申请
US20140054800A1 METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD FOR MANUFACTURING A BOND PAD OF A CHIP, A DIE ARRANGEMENT AND A CHIP ARRANGEMENT
有权
制造DIE的金属片结构的方法，制造芯片的粘合剂的方法，DIE布置和芯片布置
- 专利标题： METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD FOR MANUFACTURING A BOND PAD OF A CHIP, A DIE ARRANGEMENT AND A CHIP ARRANGEMENT
- 专利标题（中）： 制造DIE的金属片结构的方法，制造芯片的粘合剂的方法，DIE布置和芯片布置
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申请号： US13590218申请日： 2012-08-21
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公开(公告)号： US20140054800A1公开(公告)日： 2014-02-27
- 发明人: Johann Gatterbauer , Bernhard Weidgans , Joerg Busch
- 申请人： Johann Gatterbauer , Bernhard Weidgans , Joerg Busch
- 申请人地址： DE Neubiberg
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Neubiberg
- 主分类号： H01L21/768
- IPC分类号： H01L21/768 ; H01L23/485
摘要：
A method for manufacturing a metal pad structure of a die is provided, the method including: forming a metal pad between encapsulation material of the die, wherein the metal pad and the encapsulation material are separated from each other by a gap; and forming additional material in the gap to narrow at least a part of the gap.