Invention Application
- Patent Title: CO-SUPPORT SYSTEM AND MICROELECTRONIC ASSEMBLY
- Patent Title (中): 共同支持系统和微电子总成
-
Application No.: US13839402Application Date: 2013-03-15
-
Publication No.: US20140055941A1Publication Date: 2014-02-27
- Inventor: Richard Dewitt Crisp , Belgacem Haba , Wael Zohni
- Applicant: INVENSAS CORPORATION
- Applicant Address: US CA San Jose
- Assignee: INVENSAS CORPORATION
- Current Assignee: INVENSAS CORPORATION
- Current Assignee Address: US CA San Jose
- Main IPC: B81B7/00
- IPC: B81B7/00

Abstract:
A system may include a microelectronic assembly having terminals and a microelectronic element, and a component for connection with the microelectronic assembly. The component may include a support structure bearing conductors configured to carry command and address information, and contacts coupled to the conductors and connected with the terminals of the microelectronic assembly. The contacts may have address and command information assignments arranged according to a first predetermined arrangement for connection with a first type of microelectronic assembly in which the microelectronic element is configured to sample command and address information coupled thereto through the contacts at a first sampling rate, and according to a second predetermined arrangement for connection with a second type of microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through a subset of the contacts at a second sampling rate greater than the first sampling rate.
Public/Granted literature
- US08787034B2 Co-support system and microelectronic assembly Public/Granted day:2014-07-22
Information query