Invention Application
US20140057072A1 METAMATERIAL DIELECTRIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
金属电介质基板及其制造方法

  • Patent Title: METAMATERIAL DIELECTRIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
  • Patent Title (中): 金属电介质基板及其制造方法
  • Application No.: US14114283
    Application Date: 2011-12-23
  • Publication No.: US20140057072A1
    Publication Date: 2014-02-27
  • Inventor: Ruopeng LiuKan HuZhiya ZhaoXigeng Miao
  • Applicant: Ruopeng LiuKan HuZhiya ZhaoXigeng Miao
  • Priority: CN201110109060.3 20110428
  • International Application: PCT/CN2011/084497 WO 20111223
  • Main IPC: H01B17/56
  • IPC: H01B17/56 H01B19/00
METAMATERIAL DIELECTRIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
Abstract:
The present invention provides a method for manufacturing a metamaterial dielectric substrate, and a metamaterial dielectric substrate manufactured using the same. According to the metamaterial dielectric substrate and the manufacturing method thereof of the present invention, an arrangement rule of pin-shaped articles in a pin-shaped array may he predetermined during the manufacture, such that the formed metamaterial dielectric substrate has pinhole-shaped arrays arranged in a specific rule. Therefore, the metamaterial dielectric substrate may implement specific modulation functions on an electromagnetic wave such as electromagnetic wave divergence, convergence or deflection, thereby providing a more flexible design for function application of the metamaterial.
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