Invention Application
- Patent Title: METAMATERIAL DIELECTRIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Patent Title (中): 金属电介质基板及其制造方法
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Application No.: US14114283Application Date: 2011-12-23
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Publication No.: US20140057072A1Publication Date: 2014-02-27
- Inventor: Ruopeng Liu , Kan Hu , Zhiya Zhao , Xigeng Miao
- Applicant: Ruopeng Liu , Kan Hu , Zhiya Zhao , Xigeng Miao
- Priority: CN201110109060.3 20110428
- International Application: PCT/CN2011/084497 WO 20111223
- Main IPC: H01B17/56
- IPC: H01B17/56 ; H01B19/00

Abstract:
The present invention provides a method for manufacturing a metamaterial dielectric substrate, and a metamaterial dielectric substrate manufactured using the same. According to the metamaterial dielectric substrate and the manufacturing method thereof of the present invention, an arrangement rule of pin-shaped articles in a pin-shaped array may he predetermined during the manufacture, such that the formed metamaterial dielectric substrate has pinhole-shaped arrays arranged in a specific rule. Therefore, the metamaterial dielectric substrate may implement specific modulation functions on an electromagnetic wave such as electromagnetic wave divergence, convergence or deflection, thereby providing a more flexible design for function application of the metamaterial.
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