Invention Application
- Patent Title: TRANSISTOR STRUCTURES AND METHODS OF FABRICATION THEREOF
- Patent Title (中): 晶体管结构及其制造方法
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Application No.: US14027713Application Date: 2013-09-16
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Publication No.: US20140061650A1Publication Date: 2014-03-06
- Inventor: Nir TESSLER , Moti MARGALIT , Oded GLOBERMAN , Roy SHENHAR
- Applicant: TECHNION RESEARCH AND DEVELOPMENT FOUNDATION LTD.
- Applicant Address: IL Haifa
- Assignee: TECHNION RESEARCH AND DEVELOPMENT FOUNDATION LTD.
- Current Assignee: TECHNION RESEARCH AND DEVELOPMENT FOUNDATION LTD.
- Current Assignee Address: IL Haifa
- Main IPC: H01L29/786
- IPC: H01L29/786

Abstract:
An electronic device is presented, such as a thin film transistor. The device comprises a patterned electrically-conductive layer associated with an active element of the electronic device. The electrically-conductive layer has a pattern defining an array of spaced-apart electrically conductive regions. This technique allows for increasing an electric current through the device.
Public/Granted literature
- US09088000B2 Transistor structures and methods of fabrication thereof Public/Granted day:2015-07-21
Information query
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