发明申请
- 专利标题: THREE-DIMENSIONAL DEVICES HAVING REDUCED CONTACT LENGTH
- 专利标题(中): 具有减少接触长度的三维装置
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申请号: US13599900申请日: 2012-08-30
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公开(公告)号: US20140061849A1公开(公告)日: 2014-03-06
- 发明人: Toru Tanzawa
- 申请人: Toru Tanzawa
- 主分类号: H01L27/10
- IPC分类号: H01L27/10 ; H01L21/768 ; H01L21/82
摘要:
Various embodiments comprise apparatuses and methods including a memory array having alternating levels of semiconductor materials and dielectric material with strings of memory cells formed on the alternating levels. One such apparatus includes a memory array formed substantially within a cavity of a substrate. Peripheral circuitry can be formed adjacent to a surface of the substrate and adjacent to the memory array. Additional apparatuses and methods are described.
公开/授权文献
- US08952482B2 Three-dimensional devices having reduced contact length 公开/授权日:2015-02-10
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