Invention Application
US20140065645A1 POLYPEPTIDE LINKER AND METHOD OF ANALYZING TARGET MATERIAL USING THE SAME
有权
聚合物链接器和使用其分析目标材料的方法
- Patent Title: POLYPEPTIDE LINKER AND METHOD OF ANALYZING TARGET MATERIAL USING THE SAME
- Patent Title (中): 聚合物链接器和使用其分析目标材料的方法
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Application No.: US13768988Application Date: 2013-02-15
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Publication No.: US20140065645A1Publication Date: 2014-03-06
- Inventor: Kyung-yeon HAN , Yeon-jeong KIM , Jae-il LEE , Jeong-gun LEE
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2012-0095001 20120829
- Main IPC: C07K16/46
- IPC: C07K16/46
Abstract:
A polypeptide linker comprising an antibody-binding region and an enzyme cleavage region, and related compositions, kits, and methods of using same.
Public/Granted literature
- US08911954B2 Polypeptide linker and method of analyzing target material using the same Public/Granted day:2014-12-16
Information query
