Systems and processes for die-cutting stretched base films are disclosed. In some examples, the systems can include fixed or adjustable die-cut heads that are offset from one another based on an amount of distortion of the base film. Systems and processes for reducing the amount of distortion or shrinking of base films are also disclosed. In some examples, the processes can include pre-shrinking the base film by exposing the film to elevated temperatures sufficient to shrink the film. The pre-shrinking can be performed on the base film material alone, or can be applied during subsequent annealing stages. The pre-shrinking can be used alone or in combination with the offset die-cutters.