发明申请
- 专利标题： Thin Semiconductor Chip Mounting
- 专利标题（中）： 薄半导体芯片安装
-
申请号： US14024803申请日： 2013-09-12
-
公开(公告)号： US20140069989A1公开(公告)日： 2014-03-13
- 发明人: Mutsumi Masumoto
- 申请人： Texas Instruments Incorporated
- 主分类号： H01L21/50
- IPC分类号： H01L21/50
摘要：
The embodiments of the invention provide a semiconductor chip mounting methods to prevent the occurrence of particles created while mounting a thin semiconductor chip onto a substrate. A semiconductor chip having conductive bumps on its main surface is held by its back via an elastic film using a suction tool having a plurality of suction holes, the semiconductor chip is positioned against a substrate provided with connection wires corresponding to said conductive bumps, and the semiconductor chip is mounted onto the substrate in such a manner that the conductive bumps connect to said connection wires, and uniform pressure is applied from the oversized bonding tool suction to the semiconductor chip via said film while said semiconductor chip is being pressed against said substrate by oversized bonding tool to keep constant pressure in order to bond said conductive bumps with said connection wires. The film assisted bonding tool has a film cooling system to assist in making vacuum holes and a through-hole tool movable relative to the bonding head to create a plurality of holes in said assist film with a plurality of needles.
信息查询
IPC分类:
