发明申请
US20140070904A1 METALIZED MOLDED PLASTIC COMPONENTS FOR MILLIMETER WAVE ELECTRONICS AND METHOD FOR MANUFACTURE
有权
金属化模制塑料组件，用于制造毫米波电子及其制造方法
- 专利标题： METALIZED MOLDED PLASTIC COMPONENTS FOR MILLIMETER WAVE ELECTRONICS AND METHOD FOR MANUFACTURE
- 专利标题（中）： 金属化模制塑料组件，用于制造毫米波电子及其制造方法
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申请号： US13607539申请日： 2012-09-07
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公开(公告)号： US20140070904A1公开(公告)日： 2014-03-13
- 发明人: Sean S. Cahill , Eric A. Sanjuan
- 申请人： Sean S. Cahill , Eric A. Sanjuan
- 主分类号： H01P11/00
- IPC分类号： H01P11/00 ; H01P5/12 ; H01P3/12
摘要：
Waveguide components that have a high degree of performance accuracy over the temperature range of interest are provided. The components require no post-formation trimming steps, are light-weight, and dimensionally stable. In addition, a method for the manufacture of these millimeter wave components is provided.