A deposition apparatus includes a plurality of deposition sources that provides different deposition materials to a substrate, a sensor assembly that senses a deposition thickness of the deposition materials evaporated from the deposition sources, and a main controller that controls the sensor assembly. The sensor assembly includes a plurality of sensor groups each including a plurality of sensors and respectively corresponding to the deposition sources, and each of the sensor groups senses the deposition thickness of the deposition material evaporated from a corresponding deposition source of the deposition sources to the substrate in response to a control of the main controller.