Invention Application
US20140077129A1 EPOXY RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD
有权
印刷电路板，绝缘膜，PREPREG和多层印刷电路板的环氧树脂组合物
- Patent Title: EPOXY RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD
- Patent Title (中): 印刷电路板，绝缘膜，PREPREG和多层印刷电路板的环氧树脂组合物
-
Application No.: US13780988Application Date: 2013-02-28
-
Publication No.: US20140077129A1Publication Date: 2014-03-20
- Inventor: Jin Seok Moon , Seong Hyun Yoo , Keun Yong Lee , Hyun Jun Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2012-0104042 20120919
- Main IPC: H01B3/40
- IPC: H01B3/40
Abstract:
Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.
Public/Granted literature
Information query
