Invention Application
- Patent Title: OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT
- Patent Title (中): 光电元件和生产光电元件的方法
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Application No.: US14117888Application Date: 2012-03-29
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Publication No.: US20140077201A1Publication Date: 2014-03-20
- Inventor: Dirk Becker , Erwin Lang , Daniel Steffen Setz
- Applicant: Dirk Becker , Erwin Lang , Daniel Steffen Setz
- Applicant Address: DE Regensburg
- Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee Address: DE Regensburg
- Priority: DE1020110076750.9 20110531
- International Application: PCT/EP2012/055602 WO 20120329
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/56
Abstract:
An optoelectronic component may include: at least one layer of the optoelectronic component; at least one adhesive on the layer of the optoelectronic component; and a cover on the at least one adhesive; wherein the at least one adhesive is cured only in a partial region above at least one of a substrate and the layer.
Public/Granted literature
- US09190628B2 Optoelectronic component and method for producing an optoelectronic component Public/Granted day:2015-11-17
Information query
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