Invention Application
- Patent Title: HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 高电子移动性晶体管及其制造方法
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Application No.: US13833979Application Date: 2013-03-15
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Publication No.: US20140077267A1Publication Date: 2014-03-20
- Inventor: Hong-Pyo HEO
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Priority: KR10-2012-0103608 20120918
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/66

Abstract:
According to example embodiments, a high electron mobility transistor (HEMT) includes a first semiconductor layer on a substrate and a second semiconductor layer on the first semiconductor layer. The first and second semiconductor layers define a recessed region. A semiconductor doped layer is in the recessed region of first and second semiconductor layers. A 2-dimensional electron gas (2DEG) region is at a portion of the first semiconductor layer adjacent to both sides of the semiconductor doped layer.
Public/Granted literature
- US08912572B2 High electron mobility transistor and method of manufacturing the same Public/Granted day:2014-12-16
Information query
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