Invention Application
- Patent Title: LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
- Patent Title (中): 层压陶瓷电子元件及其制造方法
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Application No.: US13956616Application Date: 2013-08-01
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Publication No.: US20140078641A1Publication Date: 2014-03-20
- Inventor: Yosuke Hirata , Hideaki Tsuji , Nagato Omori , Hiroyuki Wada , Takashi Hiramatsu , Yoshito Saito
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Nagaokakyo-Shi
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi
- Priority: JP2009-141866 20090615; JP2009-156655 20090701
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/12

Abstract:
A laminated body is divided into a large grain region and a small grain region. The large grain region is located outside the small grain region, and a boundary surface between the regions is located inside the outer surface of the laminated body while surrounding a section in which internal electrodes are present in the laminated body. To obtain the laminated body, firing is carried out with a profile in which the average rate of increase from room to the maximum temperature is 40° C./second or more.
Public/Granted literature
- US09183986B2 Laminated ceramic electronic component and manufacturing method therefor Public/Granted day:2015-11-10
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