Invention Application
US20140080257A1 METHOD FOR NON-PLANAR CHIP ASSEMBLY 有权
非平板芯片组装方法

  • Patent Title: METHOD FOR NON-PLANAR CHIP ASSEMBLY
  • Patent Title (中): 非平板芯片组装方法
  • Application No.: US14084482
    Application Date: 2013-11-19
  • Publication No.: US20140080257A1
    Publication Date: 2014-03-20
  • Inventor: Long-Sheng Fan
  • Applicant: Long-Sheng Fan
  • Main IPC: H01L23/00
  • IPC: H01L23/00
METHOD FOR NON-PLANAR CHIP ASSEMBLY
Abstract:
Methods and apparatuses for assembly of a non-planar device based on curved chips are described. Slots may be created as longitudinal openings in the chips to reduce bending stresses to increase allowable degrees of deformation of the chips. The chips may be deformed to a desired deformation within the allowable degrees of deformation via the slots. Holding constraints may be provided on at least a portion of the chips to allow the chips to remain curved according the desired deformation.
Public/Granted literature
Information query
Patent Agency Ranking
0/0