Invention Application
- Patent Title: METHOD FOR SINGULATING A COMPONENT COMPOSITE ASSEMBLY
- Patent Title (中): 用于组合组分复合组件的方法
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Application No.: US14002754Application Date: 2012-03-16
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Publication No.: US20140080287A1Publication Date: 2014-03-20
- Inventor: Heribert Zull , Korbinian Perzlmaier , Andreas Ploessl , Thomas Veit , Mathias Kampf , Jens Dennemarck , Bernd Bohm
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Priority: DE102011015725.5 20110331
- International Application: PCT/EP2012/054714 WO 20120316
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/78
Abstract:
A method relates to separating a component composite into a plurality of component regions, wherein the component composite is provided having a semiconductor layer sequence comprising a region for generating or for receiving electromagnetic radiation. The component composite is mounted on a rigid subcarrier. The component composite is separated into the plurality of component regions, wherein one semiconductor body is produced from the semiconductor layer sequence for each component region. The component regions are removed from the subcarrier.
Public/Granted literature
- US09165816B2 Method for singulating a component composite assembly Public/Granted day:2015-10-20
Information query
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