发明申请
US20140083495A1 CONDUCTIVE SILVER PASTE FOR A METAL-WRAP-THROUGH SILICON SOLAR CELL
有权
用于金属缠绕硅太阳能电池的导电银浆
- 专利标题： CONDUCTIVE SILVER PASTE FOR A METAL-WRAP-THROUGH SILICON SOLAR CELL
- 专利标题（中）： 用于金属缠绕硅太阳能电池的导电银浆
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申请号： US14021137申请日： 2013-09-09
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公开(公告)号： US20140083495A1公开(公告)日： 2014-03-27
- 发明人: BRIAN J. LAUGHLIN , Yueli Wang , Cengiz Ahmet Palanduz , Terry Roland Suess
- 申请人： E I DU PONT DE NEMOURS AND COMPANY
- 申请人地址： US DE Wilmington
- 专利权人： E I DU PONT DE NEMOURS AND COMPANY
- 当前专利权人： E I DU PONT DE NEMOURS AND COMPANY
- 当前专利权人地址： US DE Wilmington
- 主分类号： H01L31/0224
- IPC分类号： H01L31/0224
摘要：
A conductive silver via paste comprising particulate conductive silver, a vanadium-phosphorus-oxide and an organic vehicle is particularly useful in providing the metallization of the holes in the silicon wafers of MWT solar cells. The result is a metallic electrically conductive via between the collector lines on the front side and the emitter electrode on the back-side of the solar cell. The paste can also be used to form the collector lines on the front-side of the solar cell and the emitter electrode on the back-side of the solar cell. Also disclosed are metal-wrap-through silicon solar cells comprising the fired conductive silver paste.
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