Invention Application
US20140087527A1 METHOD OF FORMING THIN FILM POLY SILICON LAYER AND METHOD OF FORMING THIN FILM TRANSISTOR
审中-公开
形成薄膜聚硅层的方法和形成薄膜晶体管的方法
- Patent Title: METHOD OF FORMING THIN FILM POLY SILICON LAYER AND METHOD OF FORMING THIN FILM TRANSISTOR
- Patent Title (中): 形成薄膜聚硅层的方法和形成薄膜晶体管的方法
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Application No.: US14035930Application Date: 2013-09-24
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Publication No.: US20140087527A1Publication Date: 2014-03-27
- Inventor: Hieng-Hsiung Huang , Wen-Chun Wang , Heng-Yi Chang , Chin-Chang Liu
- Applicant: WINTEK CORPORATION
- Applicant Address: TW Taichung City
- Assignee: WINTEK CORPORATION
- Current Assignee: WINTEK CORPORATION
- Current Assignee Address: TW Taichung City
- Priority: TW101135117 20120925
- Main IPC: H01L29/786
- IPC: H01L29/786

Abstract:
A method of forming a thin film poly silicon layer includes following steps. Firstly, a substrate is provided. A thin film silicon layer is then formed on the substrate by a silicon thin film deposition process. A heating treatment is then applied to the substrate so as to convert the thin film silicon layer into a thin film poly silicon layer. A method of forming a thin film transistor includes following steps. A first patterning process is performed on the thin film poly silicon layer on the substrate to form a semiconductor pattern. Subsequently, a gate insulation layer, a gate electrode, a source electrode and a drain electrode are formed.
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