Invention Application
- Patent Title: METHODS AND SYSTEMS FOR JOINING MATERIALS
- Patent Title (中): 接合材料的方法与系统
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Application No.: US13630874Application Date: 2012-09-28
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Publication No.: US20140093658A1Publication Date: 2014-04-03
- Inventor: Qi Zhao , Robert John Zabala , Laurent Cretegny , Jeffrey Jon Schoonover , Mark Kevin Meyer , Keith Anthony Lauria , William R. Catlin
- Applicant: GENERAL ELECTRIC COMPANY
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Main IPC: B05D3/06
- IPC: B05D3/06
Abstract:
A method is provided for joining a filler material to a substrate material. The method includes melting the filler material within a melting chamber of a crucible such that the filler material is molten, holding the filler material within the melting chamber of the crucible by electromagnetically levitating the filler material within the melting chamber, and releasing the filler material from the melting chamber of the crucible to deliver the filler material to a target site of the substrate material.
Information query
